Activation and etching for better adhesion
Plasma allows a form-locking and seamless ocombination of high end plastics (ie. PEEK/PEKK) with other materials.Activation and etching of surfaces with an ionized mix of oxygen and argon gas in many cases allows abdication of primers.Oxygen radicals increase the surface energy and the bombardement with argon atoms create a sandblasting-effect, changing the surface topography in the nano-scales. Herewith a retention-base is provided.By reducing or preventing adhesives, the risk for allergic patients will be minimized.
Also, for the dental lab, an interesting cost reducing potential can be realized.
The following materials can be activated, intensive cleaned and etched with Plasma:
- Acetal (POM)
- PE, PA,or PMMA
- Metalls (NM, NNM, Titanium)
- Zirconia and Ceramics
2. Reduction of germs
At a process temperature of approx. 60°C germs and viruses will be destroyed, turned into the gas phase and vacuumed by the integrated pump. Due to the form-locking, seamless properties of plasma, working-parts with complex geometries can be intensive-cleaned.
3. Environment protection
Plasma is an outstanding environment protective technology. It works with a standard power supply of 110/230 V. Using a high-vacuum of 0.3 mbar, the consumption of process gasses (Oxygen/Argon) is extremely low.
The DENTAPLAS PC offers:
- simple and safe handling
- optimized processes according to materials
- automatic course of action
- low process temperatures
- integrated vacuum pump